Measurements of residual stresses in Al film/silicon nitride substrate microcantilever beam systems
Autor: | Chiao-Chi Lin, Sanboh Lee, Weileun Fang, Chun-Hway Hsueh, Hung-Yi Lin |
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Rok vydání: | 2011 |
Předmět: |
Materials science
Atomic force microscopy Mechanical Engineering chemistry.chemical_element Condensed Matter Physics Residual chemistry.chemical_compound chemistry Silicon nitride Mechanics of Materials Aluminium Residual stress Deflection (engineering) Ultimate tensile strength General Materials Science Composite material Bending strain |
Zdroj: | Journal of Materials Research. 26:1279-1284 |
ISSN: | 2044-5326 0884-2914 |
Popis: | Microcantilevers fabricated by microelectromechanical system processes were used to study the residual stresses in the film/substrate systems. Aluminum films were deposited on silicon nitride substrates by thermal evaporation at room and elevated temperatures, and residual stresses were characterized from the deflection profiles of the Al/SiNx microcantilevers. The Al/SiNx microcantilever beam made of room-temperature-deposited Al film was found to deflect toward the substrate side, which in turn resulted in compressive residual stress in the film. In contrary, the microcantilever of Al film deposited at 105 °C was found to deflect toward the side of Al film when the thickness ratio of film to substrate was greater than 0.31 and the residual film stresses were tensile. The axes with zero bending strain component and zero stresses, i.e., the bending and the neutral axes in the film/substrate system were also investigated. The results can be applied to the arm of the atomic force microscope to characterize its deflection and stresses. |
Databáze: | OpenAIRE |
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