| Autor: |
Myeong-Hyeok Jeong, Young-Bae Park, Jae-Myeong Kim, Sang-Hyun Kwon, Sehoon Yoo |
| Rok vydání: |
2011 |
| Předmět: |
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| Zdroj: |
18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). |
| DOI: |
10.1109/ipfa.2011.5992741 |
| Popis: |
The effects of electroless nickel immersion gold (ENIG) and immersion Sn pad finishes on the shear strength of Sn-3.0Ag-0.5Cu solder joints were investigated under the various loading speeds of 0.2∼1,000 mm/s. shear strength increased with increasing shear speed, while ductility and toughness decreased, while immersion Sn finish showed lower shear strength rather than ENIG finish. Overall, ENIG finish showed ductile to brittle fracture mode transition with increasing shear speed while immersion Sn finish only showed increasing brittle fracture mode ratio. Therefore, strong interfacial adhesion of ENIG finish rather than immersion Sn finish seems to be related to stronger bonding strength and also higher toughness of ENIG finish. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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