Electrical properties of thermoset/thermoplastic blends: Influence of the nature of the thermoplastic
| Autor: | Sébastien Pruvost, Nour Halawani, J.-L. Auge, O. Gain |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
010302 applied physics
chemistry.chemical_classification Materials science Thermoplastic Electrical breakdown Relative permittivity Thermosetting polymer 02 engineering and technology Epoxy Dynamic mechanical analysis 021001 nanoscience & nanotechnology Polyetherimide 01 natural sciences chemistry.chemical_compound chemistry visual_art 0103 physical sciences visual_art.visual_art_medium Thermoplastic elastomer Composite material 0210 nano-technology |
| Zdroj: | 2016 IEEE International Conference on Dielectrics (ICD). |
| DOI: | 10.1109/icd.2016.7547608 |
| Popis: | In power electronics, electrical insulation encapsulation at high temperatures and/or high voltages is a challenge for the systems such as IGBT. Different materials are used and tested in industry and literature. Silicone elastomers for example associated with a primary passivation layer of polyimide are considered to be good candidates but are limited to 180 – 200 °C. Epoxy thermosets are known to be good insulator to protect electrical devices from moisture, dust and short circuits electrical breakdown. Thermoset/thermoplastic blends can be another good candidate for electrical insulation properties. The thermoplastic, its percentages as well as the curing conditions control the final morphology (phase separation with disperse thermoplastic phase, bicontinuous phases or inverted structure …) and thus the electrical properties of the sample. In our study, polyetherimide (PEI) and Polystyrene (PS) thermoplastics were introduced with different percentages into the epoxy system. Electronic microscopy images showed similar phase separation phenomenon with different size of nodules of the thermoplastics. The effect of the morphology on mechanical, electrical and thermal properties has been investigated. The addition of 6 wt% of PS and 10%wt of PEI gives nodules of thermoplastic with a micrometer size inside the epoxy amine network where it did not affect either the storage modulus or the thermal resistance under air or nitrogen atmosphere. Whereas, the dielectric spectroscopy points out that, the addition of polystyrene into the epoxy system increased the relative permittivity of the blend. Contrariwise, the addition of polyetherimide into the epoxy system has decreases the relative permittivity by 15 % in all the temperature and frequency ranges compared with the pure epoxy amine network. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|