Development of an Integrated Design System for Thermal Reliability Prediction of SMT Solder Interconnects

Autor:	Y.-H. Pao, Edward Chan-Jiun Jih, V. Siddapureddy
Rok vydání:	1996
Předmět:	Integrated design Mechanics of Materials Computer science Soldering Electrical and Electronic Engineering Thermal reliability Reliability (statistics) Computer Science Applications Electronic Optical and Magnetic Materials Reliability engineering
Zdroj:	Journal of Electronic Packaging. 118:235-243
ISSN:	1528-9044 1043-7398
DOI:	10.1115/1.2792158
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e9543c6e2f994813abc982bbe64af0d0 https://doi.org/10.1115/1.2792158 Zobrazit plný text záznamu