A novel highly electrically conductive silver paste
| Autor: | Jiin-Chyuan Chang, Chiao-Yang Lin, Jia-Min Lin, Ching-Fen Lin, Wei-Nung Chen |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Interconnection
Reaction mechanism Materials science Nanoparticle 02 engineering and technology Epoxy Conductivity 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences 0104 chemical sciences Silver paste Electrical resistivity and conductivity visual_art visual_art.visual_art_medium Adhesive Composite material 0210 nano-technology |
| Zdroj: | 2016 International Conference on Electronics Packaging (ICEP). |
| DOI: | 10.1109/icep.2016.7486902 |
| Popis: | A novel highly electrically conductive silver paste is prepared. With the addition of suitable reactive components and the appropriate binder composition, good interconnection between the silver particles is established during the curing process of the silver paste, which enhances its electrical conductivity. The composition, reaction mechanism, morphology of the silver particles and performance of the silver pastes are discussed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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