Autor: |
C. Wyon, D. K. Agnihotri, J. P. Formica, F. Cacho, Y. Tsach, L. F. Tz. Kwakman, J.‐P. Gonchond, G. Rolland, G. Braeckelmann |
Rok vydání: |
2005 |
Předmět: |
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Zdroj: |
AIP Conference Proceedings. |
ISSN: |
0094-243X |
DOI: |
10.1063/1.2062960 |
Popis: |
X ray reflectivity (XRR) is shown to be well suited to measure the thickness of NiSi films annealed at different temperatures. The phase transformation during the silicide reaction at different spike annealing temperatures (310°C–450°C) has been characterized by measuring the sheet resistance (Rs). Combining Rs and XRR measurements, the resistivity of the nickel silicide is deduced, showing a factor ∼3 difference between the high‐resistivity Ni2Si phase and the low‐resistivity NiSi phase. A measured 49‐point contour map shows wafer non‐uniformity |
Databáze: |
OpenAIRE |
Externí odkaz: |
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