Modulus Graded Composite Adherends for Single-Lap Bonded Joints
| Autor: | V. K. Ganesh, T. S. Choo |
|---|---|
| Rok vydání: | 2002 |
| Předmět: |
Materials science
Mechanical Engineering Linear elasticity Modulus 02 engineering and technology 021001 nanoscience & nanotechnology Stress (mechanics) 020303 mechanical engineering & transports Lap joint 0203 mechanical engineering Mechanics of Materials Materials Chemistry Ceramics and Composites Shear stress Braid Composite material 0210 nano-technology Elastic modulus Joint (geology) |
| Zdroj: | Journal of Composite Materials. 36:1757-1767 |
| ISSN: | 1530-793X 0021-9983 |
| DOI: | 10.1177/0021998302036014172 |
| Popis: | The effect of spatial grading of adherend elastic modulus on the peak stress and stress distribution in the single-lap bonded joint is studied. Single-lap joint with various modulus grading profiles were studied and the results compared with the traditional uniform modulus adherends using linear elastic finite element analysis. Braided preform with continuously varying braid angle was fabricated and the variation of the braid angle measured to realistically evaluate the performance of adherend modulus grading in single-lap bonded joint. The peak stress, stress distribution and transverse displacement at the adhesive mid-thickness were used to compare between the different adherend modulusgrading. The maximum shear stress reduced by about 20% and the shear stress was more uniformly distributed in the adhesive for an actual case of adherend modulus grading. It was also noticed that the joint rotation wasminimum for thisactual case of adherend grading. |
| Databáze: | OpenAIRE |
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