Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations
Autor: | Richard J. F. van Haren, Suwen Li, Blandine Minghetti, Leon van Dijk, Klaas Brantjes, Frank Fournel, Gaelle Mauguen, Ivanie Mendes, Celine Lapeyre, Marie-Line Pourteau, Michael May, Laurent Pain, Karine Abadie, Thomas Plach, Markus Wimplinger |
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Rok vydání: | 2023 |
Zdroj: | Metrology, Inspection, and Process Control XXXVII. |
Databáze: | OpenAIRE |
Externí odkaz: |