Process Flow and Cost Modelling for Fan-Out Panel Level Packaging
| Autor: | Mathilde Billaud, Lutz Stobbe, Klaus-Dieter Lang, Tanja Braun, Nils F. Nissen, Hannes Zedel |
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| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Flexibility (engineering) Cost allocation Relation (database) Process (engineering) Computer science 05 social sciences Fan-out 01 natural sciences Reliability engineering Identification (information) 0103 physical sciences 0501 psychology and cognitive sciences Granularity Wafer-level packaging 050104 developmental & child psychology |
| Zdroj: | 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). |
| Popis: | In response to the emerging trends in packaging technologies, detailed cost analysis models are required to assess the economical and environmental feasibility of different technology options, business scenarios, design options, and process configurations. As established models do not provide a sufficient level of granularity both in representing realistic industrial processes and detailing the cost allocation, a new Multi Level Level Cost Model was developed for comparative cost assessments. The new strategy follows a bottom-up approach and allocates cost-relevant process data to every piece of equipment to allow differentiated cost analyses and identification of optimization strategies. The model is best suited for relative comparisons and enables realistic estimates of real packaging costs if the data input requirements are met adequately. The flexibility and efficacy of the model is demonstrated in this paper with an exemplary Chip First Fan-Out Panel Level Packaging process. The analysis investigates 1) the cost evolution in relation to the number of RDLs, 2) a preliminary estimate of yield requirements to compete with Wafer Level Packaging, 3) an analysis of substrate and package design choices with regard to substrate area utilization and its economic and environmental impact. |
| Databáze: | OpenAIRE |
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