Study on Mechanical Behavior and Long-term Storage Reliability of Micro Flip Chip Mixed Solder Joints

Autor:	Shuang Xie, Huidong Wen, Yong Wang, Pengrong Lin, Xiaochen Xie, Yingzhuo Huang
Rok vydání:	2021
Zdroj:	2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc53413.2021.9663895
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e827df51eeb6ae8d80e620200517dd9d https://doi.org/10.1109/eptc53413.2021.9663895 Zobrazit plný text záznamu