Thermal stress in semiconductor encapsulating materials
| Autor: | R.W. Biernath, M. J. Molter, W.F. van den Bogert, D. J. Belton, D.S. Soane |
|---|---|
| Rok vydání: | 1988 |
| Předmět: |
Materials science
business.industry Bilayer General Engineering Atmospheric temperature range Curvature Industrial and Manufacturing Engineering Viscoelasticity Electronic Optical and Magnetic Materials Stress (mechanics) Semiconductor Thermomechanical analysis Electrical and Electronic Engineering Composite material business |
| Zdroj: | IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 11:245-252 |
| ISSN: | 0148-6411 |
| Popis: | To examine molding-compound-induced stresses, and to determine the influence of the time-dependent and temperature-dependent thermomechanical properties of the molding compound, a linear viscoelastic analysis has been applied to a simple bilayer structure. Stress generation is examined over the temperature range from -150 degrees C to the molding temperature (180 degrees C), based on a complete consideration of the thermomechanical properties of a molding compound. Stress calculations are compared to experimentally determined radii of curvature of the bilayer structure as a function of temperature. Both calculated and experimental results demonstrate the necessity to consider a complete materials description in order to adequately describe stress generation. The importance of the viscoelastic contribution of the transition range and the temperature-dependent elastic contribution of the glassy state to stress generation are highlighted. > |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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