Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer
Autor: | Prashant Kumar Singh, Kashi Vishwanath Machani, Dirk Breuer, Michael Hecker, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock |
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Rok vydání: | 2023 |
Zdroj: | 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). |
DOI: | 10.1109/eurosime56861.2023.10100826 |
Databáze: | OpenAIRE |
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