Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer

Autor: Prashant Kumar Singh, Kashi Vishwanath Machani, Dirk Breuer, Michael Hecker, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock
Rok vydání: 2023
Zdroj: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
DOI: 10.1109/eurosime56861.2023.10100826
Databáze: OpenAIRE