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This chapter aims to provide a repository of knowledge, tips, and tactics relating to the successful integration of functional materials into functional devices. It highlights a number of functional materials that have potential applications in a wide range of microdevices and are found in the form of thick films. It explores the interrelated effects of temperature, chemistry, and stress and how they affect the co-processing of different materials. Microdevices come in many different types and designs but they all share common features that affect the ability to create these devices. Their base design is composed of three parts including functional material, electrode material, and structural material. This chapter provides a brief review of the different types of structures that exist in the microdevices. It also discusses the challenges of integrating ceramics with other materials found in microsystems and MEMS besides exploring some of the applications where thick films are used. One of the most used groups of functional materials are piezoelectrics—functional materials that are able to deform on the application of an electrical signal as well as produce an electrical signal when subjected to a mechanical force. The other functional materials are pyroelectrics, ferroelectrics, ion conductors, electron conductors, thermoelectrics, and multiferroics and many of these are based on ceramic materials. |
