Designs of low stress I/O pin attach structures
| Autor: | P. Palmateer, D. Waldman, J. Kim, J. Corso, Balaram Ghosal, R. Pasco, G. Advocate, S. Cvikevich, Y. Fu, A. Arnold, Peter J. Brofman, S. Kapur, P. Hayunga, D.-Y. Shih |
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| Rok vydání: | 1992 |
| Předmět: |
Materials science
Packaging engineering business.industry General Engineering Structural engineering Industrial and Manufacturing Engineering Finite element method Electronic Optical and Magnetic Materials Stress (mechanics) Flexural strength Soldering visual_art visual_art.visual_art_medium Brazing Ceramic Electrical and Electronic Engineering Composite material business Failure mode and effects analysis |
| Zdroj: | IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 15:369-377 |
| ISSN: | 0148-6411 |
| Popis: | Three low-stress pin attachment structures were developed for the glass ceramic-copper multilayer ceramic (MLC) packaging technology used in IBM ES 9000 processors. The structures include the multilayer thin-film I/O pads, taper-headed pin and low-stress solder as the joining alloy. All of them were shown to reduce the pin-joint stress significantly and, consequently, are more compatible with the glass-ceramic module. The authors summarize both experimental and finite-element analysis studies to optimize the stress of the pin-attach system such that the pins can be joined to the glass-ceramic MLC with good reliability. The design goal was to have a pin-joint structure in which the ceramic and the pin-joint will survive a pin-pull test up to 10 lbs with a repairable pin-shank failure mode. The combined stresses generated from the braze, pin loading, and I/O pad should not exceed the fracture strength of the ceramic substrate. Finite-element modeling identified high-stress regions and possible failure modes of each pin joint design. The three approaches taken to reduce the stress of the pin-joint are described. > |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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