Mechanical Modeling and Characterization of the Curing Process of Underfill Materials
| Autor: | H.J.L. Bressers, A. W. J. den Boer, J. Janssen, L.J. Ernst, J.F.J.M. Caers, Guoqi Zhang, C. van 't Hof, M.S. Kiasat, Daoguo Yang |
|---|---|
| Rok vydání: | 2002 |
| Předmět: |
chemistry.chemical_classification
Stress (mechanics) Materials science chemistry Mechanics of Materials Polymer Electrical and Electronic Engineering Deformation (meteorology) Composite material Flip chip Computer Science Applications Electronic Optical and Magnetic Materials Characterization (materials science) |
| Zdroj: | Journal of Electronic Packaging. 124:97-105 |
| ISSN: | 1528-9044 1043-7398 |
| DOI: | 10.1115/1.1459471 |
| Popis: | Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is often judged through thermal and mechanical simulations, under assumed operating conditions. Because of lacking insight into the mechanical processes due to polymer curing, the impact of processing induced residual stress fields is often neglected. To investigate the evolution of stress and strain fields during the curing process it is important to assume a more appropriate starting point for subsequent process modeling. Furthermore, study of possible damage originating from the fabrication process then comes within reach. To facilitate future analysis of stress and strain fields during the curing process a cure dependent constitutive relation is assumed. An approximate investigation method for the process-dependent mechanical properties, based on Dynamic Mechanic Analysis (DMA), is developed. As an illustration the parameter identification is performed for a selected epoxy resin. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|