Lead-Free Solder Paste and Reflow Soldering

Autor:	Shinichi Fujiuchi
Rok vydání:	2003
Předmět:	Reflow soldering Materials science Dip soldering Reflow oven Metallurgy Solder paste Lead (electronics)
Zdroj:	Lead-Free Soldering in Electronics: Science, Technology, and Environmental Impact
DOI:	10.1201/9780203025772.ch8
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e668786bf86d538dada099e73a805c61 https://doi.org/10.1201/9780203025772.ch8 Zobrazit plný text záznamu