Temperature Prediction on Substrates and integrated Circuit Chips

Autor:	B. B. Mikić, E. J. Pinto
Rok vydání:	1988
Předmět:	Fluid Flow and Transfer Processes Work (thermodynamics) Materials science Mechanical Engineering Integrated circuit Function (mathematics) Mechanics Condensed Matter Physics law.invention symbols.namesake Thermal conductivity Fourier transform law Thermal symbols Transient (oscillation) Anisotropy
Zdroj:	Heat Transfer Engineering. 9:54-65
ISSN:	1521-0537 0145-7632
DOI:	10.1080/01457638808939671
Popis:	This work deals with application of semianalytical methods for evaluation of temperature distribution on substrates and integrated circuit chips. This approach is based on a method proposed by Hein and Lenzi in 1969 which is a combination of Fourier transform. Green's function, and surface-element methods. The application of the method has evolved from a model that predicts the steady-state temperature on one-layer structures with lead connectors (modeled as lumped thermal resistances) and planar-discrete sources to a model that includes the effects of multiple layers and anisotropic thermal conductivity. Further generalization of the method to three new cases is presented. The first includes the transient thermal behavior in the one-layer structures with planar-discrete sources and anisotropic conductivity. The second deals with the steady-periodic behavior of two-layer structures with planar-discrete-periodic sources and anisotropic conductivity. The third case solves for the steady-state temperature in...
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e6172ad0f1fe58cfe478f49f9310c5d4 https://doi.org/10.1080/01457638808939671 Zobrazit plný text záznamu