| Autor: |
Heng Lee, Wei-Kuo Han, Jing-Yao Chang |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| DOI: |
10.1109/impact50485.2020.9268540 |
| Popis: |
A new SSMT (Sim Surface Mount Technology) IPM (Intelligent Power Module) is a fully optimized inverter module for electrically assisted bike’s motor drive applications. The size of the module is smaller than that of conventional TO type while keeping equivalent performance and reliability. It also reduces its power density and parasitic performance. A built-in driver and bootstrap diodes are highly integrated with power components in one module, which enables to create the layout simpler and easier and also improve the thermal issue. A new SSMT IPM with the full mold type substrate enhances the cost-effectiveness. Moreover, a DPC (Direct plating Copper) substrate will provide a technical advantage to further improve the performance in the future. This paper explains about electrical characteristics, circuit configurations, package technology, thermal performance, and power rating of the improved new SSMT IPM. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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