DELAMINATION ANALYSIS OF PLASTIC PACKAGES DURING SOLDER REFLOW BY STRAIN-GAGE MEASUREMENT AND TOMOGRAPHIC ACOUSTIC MICRO IMAGING METHODS

Autor:	Chris Chang, John H. Lau
Rok vydání:	1998
Předmět:	endocrine system Materials science Micro imaging Delamination food and beverages eye diseases Industrial and Manufacturing Engineering Soldering Ball grid array sense organs Electrical and Electronic Engineering Composite material psychological phenomena and processes Strain gauge
Zdroj:	Journal of Electronics Manufacturing. :165-172
ISSN:	0960-3131
DOI:	10.1142/s096031319800015x
Popis:	The popcorning of plastic packages is analyzed using the electrical-resistance strain gage and tomographic acoustic micro imaging methods. The electrical-resistance strain gage measurement shows when the popcorning occurs. The tomographic acoustic micro imaging technique detects the delaminations and voids. A plastic ball grid array (PBGA) package is used as an example.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e5dea5f79025cab96662d67d144bf609 https://doi.org/10.1142/s096031319800015x Zobrazit plný text záznamu