Sn-based solder design using machine learning approach

Autor:	Yu-Chen Liu, Chih-Han Yang, Shih-Kang Lin
Rok vydání:	2022
Zdroj:	2022 International Conference on Electronics Packaging (ICEP).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e5cc4c7c01c63802588d6d0547aec069 https://doi.org/10.23919/icep55381.2022.9795569 Zobrazit plný text záznamu