Pattern transferring of Prolift-100 polymer sacrificial layers with controlled sidewall profile

Autor:	Hemendra Kala, Mariusz Martyniuk, K. K. M. B. Dilusha Silva, Kirsten Papanastasiou, Jarek Antoszewski, Jorge R. Silva, Dhirendra Kumar Tripathi, Gino Putrino, Adrian Keating, Lorenzo Faraone
Rok vydání:	2021
Předmět:	Microelectromechanical systems chemistry.chemical_classification Materials science chemistry Mechanics of Materials Mechanical Engineering Undercut Dry etching Polymer Electrical and Electronic Engineering Composite material Electronic Optical and Magnetic Materials
Zdroj:	Journal of Micromechanics and Microengineering. 31:075001
ISSN:	1361-6439 0960-1317
Popis:	While wet pattern transferring of polymers is faster than dry processing, it can lead to excessive undercut that will erode and distort features in patterned sacrificial regions during micro electro mechanical systems (MEMSs) fabrication. Dry etching processes based on O2, CF4 and N2 chemistry reduce undercutting of features to around 2 µm, but the resulting sidewall profiles of the patterned polymer islands are generally unsuitable for subsequent conformal deposition of thin films for surface micromachined MEMS fabrication. This paper presents a dry etching process for Prolift-100-16 polymer sacrificial layers, that employs a combination of a hard mask and a subsidiary sacrificial layer, that overcomes the limitations of undercut control and conformal deposition of physical vapour deposition techniques. The dry etching process is optimized to reduce the feature undercut to as low as 1 µm, while also producing sidewall profiles suitable for subsequent conformal deposition of thin films.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e5b26624a27f0ff43d7d1d3276f5e76f https://doi.org/10.1088/1361-6439/abfa7e Zobrazit plný text záznamu