| Autor: |
Lwo Ben-Je, Zhong-Yi Wu, Harrison Chung, Jeff Kao, Annie Hu, Robert Lee, Pei-Hsuan Wu, Hao-Chun Tang, Richard Chen |
| Rok vydání: |
2013 |
| Předmět: |
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| Zdroj: |
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). |
| DOI: |
10.1109/impact.2013.6706643 |
| Popis: |
To analyze thermal and thermo-stress behaviors of the diode packaging for high power applications, a global-local scheme through finite element simulations are performed in this study. To derive necessary boundary conditions and to verify the simulation results, thermal experiments are carried out for comparisons. New diode packaging designs are next proposed in this paper and their thermal resistance and structure stress are finally compared with the currently used ones to study the improvements. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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