Correlation between Package‐Level High‐Speed Solder Ball Shear/Pull and Board‐Level Mechanical Drop Tests with Brittle Fracture Failure Mode, Strength, and Energy

Autor:	S. Clark, Fubin Song, S. W. Ricky Lee, Keith Newman, B. Sykes
Rok vydání:	2011
Předmět:	Shear (sheet metal) Materials science Drop tests Composite material Solder ball Failure mode and effects analysis Energy (signal processing) Brittle fracture
Zdroj:	Structural Dynamics of Electronic and Photonic Systems
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e57b459de68624650ce82212d0b51a93 https://doi.org/10.1002/9780470950012.ch10 Zobrazit plný text záznamu