Dependence of the quality of thick resist structures on resist baking
| Autor: | Freimut Reuther, A. Maciossek, Gabi Gruetzner, G. Bleidiessel, Bernd Loechel, S. Fehlberg |
|---|---|
| Rok vydání: | 1998 |
| Předmět: |
Materials science
business.industry Photoresist Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention Resist law Ultraviolet irradiation Optoelectronics Infrared heater Electrical and Electronic Engineering Photolithography business Thick photoresist |
| Zdroj: | Microelectronic Engineering. :433-436 |
| ISSN: | 0167-9317 |
| Popis: | Interest in thick photoresist applications is steadily growing. Specialised equipment has been developed to cope with the new challenges to process and pattern extremely thick photoresist layers. A decisive step in the preparation of resist layers is the prebaking. The impact of three different prebaking technologies on the resist performance has been investigated. Resist patterns obtained after oven, hotplate or IR prebaking exhibit equal high quality. Compared to oven and hotplate baking the process length and energy consumption is markedly reduced using IR radiation favouring this variant to be the optimum prebaking process for very thick photoresist layers. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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