Millimeter-Wave Wireless Interconnect for 3-D SIC Testing
| Autor: | Julia Hsin-Lin Lu, Byunghoo Jung, Wing-Fai Loke |
|---|---|
| Rok vydání: | 2014 |
| Předmět: |
Wireless interconnect
business.industry Millimeter wave circuits Computer science Electrical engineering Ic testing chemistry.chemical_compound chemistry Hardware and Architecture Extremely high frequency Electronic engineering Silicon carbide Wireless Electrical and Electronic Engineering Transceiver Latency (engineering) business Software |
| Zdroj: | IEEE Design & Test. 31:29-37 |
| ISSN: | 2168-2364 2168-2356 |
| Popis: | As 3-D ICs gain popularity in the industry, finding an efficient way to test the stacked chips is becoming a new challenge. The authors of this paper present a contact-free testing method using millimeter-wave wireless I/Os with microbump antennas. This method has the potential to reduce the latency and cost of 3-D IC testing. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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