Microstructure Evolution and the Constitutive Relations of High-Temperature Solders
Autor: | David Shaddock, Harry Schoeller, Aaron Jay Knobloch, Junghyun Cho, Shubhra Bansal |
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Rok vydání: | 2009 |
Předmět: |
Materials science
Constitutive equation Metallurgy Temperature cycling Strain hardening exponent Condensed Matter Physics Microstructure Electronic Optical and Magnetic Materials Solid solution strengthening Ultimate tensile strength Materials Chemistry Electrical and Electronic Engineering Composite material Elastic modulus Tensile testing |
Zdroj: | Journal of Electronic Materials. 38:802-809 |
ISSN: | 1543-186X 0361-5235 |
Popis: | This study characterized the temperature-dependent constitutive parameters (yield strength, ultimate tensile strength, elastic modulus, strain hardening exponent) from the mechanical behavior of five high-temperature solders, 95Sn-5Sb, 95Pb-5In, 90Pb-10Sn, 92.5Pb-5Sn-2.5Ag, and 93Pb-3Sn-2In-2Ag, chosen such that T m > 518 K. To model appropriately their mechanical responses under high-temperature thermal cycling, where the temperatures exceed 473 K, the material’s parameters must be determined as a function of temperature. Uni-axial tensile tests were, therefore, carried out between 298 K and 473 K to determine the constitutive behavior of each solder. 95Sn-5Sb exhibited the highest strength over the temperature range tested except near 473 K. Pb-based alloys with a higher degree of solid solution (>5%) showed greater strengthening than those primarily strengthened by coarse precipitates. Additionally, microstructure changes in 90Pb-10Sn and 95Sn-5Sb were shown to be responsible for unexpected mechanical behavior at elevated temperatures. |
Databáze: | OpenAIRE |
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