| Autor: |
D. Lochun, E. Zeira, R. Menize |
| Rok vydání: |
2003 |
| Předmět: |
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| Zdroj: |
52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345). |
| DOI: |
10.1109/ectc.2002.1008172 |
| Popis: |
We report a reel-to-reel manufacturing method for flexible electrical interconnects with copper conductivity that can be attained from a two-stage process of printing and electrolytic plating. This process can rapidly manufacture a range of patterns that can be applied to single sided circuitry including radio frequency identification structures. We disclose a method to print a material on a reel-to-reel printer that has sufficient conductivity to allow subsequent electrolytic plating on a reel-to-reel processing line and have sufficient ink/substrate adhesion to withstand the aggressiveness of the electrolytic plating chemistry, Depending on the printing technology chosen speeds of 150 feet per minute (fpm) to 300 fpm can be readily achieved. Judicious choice of image design will facilitate reel-to-reel electrolytic plating on a dedicated line. Electrolytic plating will occur only on connected lines and is therefore an additive technology eliminating the requirement for an etching step and so reducing the environmental impact of printed circuit manufacture. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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