Al-plug stacked contact/via process for deep submicron CMOS multilayer metal technology
| Autor: | F.S. Chen, F.T. Liou, G.A. Dixit, M. Zamanian, G. DeSanti |
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| Rok vydání: | 2002 |
| Předmět: |
Very-large-scale integration
Materials science business.industry Process (computing) Electrical engineering chemistry.chemical_element Hardware_PERFORMANCEANDRELIABILITY Integrated circuit Sputter deposition law.invention CMOS chemistry Aluminium Sputtering law Hardware_INTEGRATEDCIRCUITS Optoelectronics business Spark plug |
| Zdroj: | 1991 International Symposium on VLSI Technology, Systems, and Applications - Proceedings of Technical Papers. |
| DOI: | 10.1109/vtsa.1991.246700 |
| Popis: | The authors describe stacked contact/via technology with Al-plug metallization that results in complete filling of submicron contacts and vias of various sizes. The Al-plug process can be done in a conventional sputtering system. Physical and electrical characteristics of the Al-plug process are compared with conventional W-plug process. The implementation of Al-plug technology into submicron integrated circuits is presented. > |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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