Detection of defective areas and hidden weak patterns in the wafer using massive measurement data

Autor:	DongHoon Kim, Sungyoon Ryu, Sunhong Jun, Heeyoon Han, Wonjun Choi, Yong-Ju Jeon, Hyun Lee, Souk Kim, Younghoon Sohn
Rok vydání:	2023
Zdroj:	Metrology, Inspection, and Process Control XXXVII.
DOI:	10.1117/12.2657064
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e4f2305f51efd0dd83961b36bcc7a105 https://doi.org/10.1117/12.2657064 Zobrazit plný text záznamu