Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability

Autor:	A R Nazmus Sakib, Marion Branch Kelly, Nikhilesh Chawla, T. Maity, D. R. Frear
Rok vydání:	2020
Předmět:	Materials science Soldering Metallurgy Materials Chemistry Substrate surface Electrical and Electronic Engineering Condensed Matter Physics Microstructure Lead (electronics) Joint (geology) Electronic materials Reliability (statistics) Electronic Optical and Magnetic Materials
Zdroj:	Journal of Electronic Materials. 49:4466-4467
ISSN:	1543-186X 0361-5235
DOI:	10.1007/s11664-020-08156-0
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e4ceb79bf4c4032d70387d144854eb67 https://doi.org/10.1007/s11664-020-08156-0 Zobrazit plný text záznamu Full text from SpringerLink