Anti-sulfidation treatment method of silver alloy bonding wire and application of LED pack silver
| Autor: | Li Chao, ChuMan Ho, Yang Bin, Guannan Yang, Zhou Zhangqiao, Hua Xiangang, Chengqiang Cui, Lin Tingyu, Yu Zhang |
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| Rok vydání: | 2020 |
| Předmět: |
010302 applied physics
Wire bonding Materials science Passivation 020208 electrical & electronic engineering Alloy Sulfidation Treatment method 02 engineering and technology Conductivity engineering.material 01 natural sciences Reflectivity law.invention law 0103 physical sciences 0202 electrical engineering electronic engineering information engineering engineering Composite material Light-emitting diode |
| Zdroj: | 2020 21st International Conference on Electronic Packaging Technology (ICEPT). |
| Popis: | With excellent conductivity, ductility, reflectivity and low-cost advantages, silver bonding wire is a more competitive material which can replace the gold wire. It is widely used in display LED and storage fields. However, the key to the application of silver bonding wire is to solve the problem of sulfidation, which causes failure and discoloration. In this paper, a kind of anti-sulfidation film of the silver bonding wire is prepared by using the self-formulated passivation process, with different current densities. The results show that the a smooth and dense passive film covers the surface of the silver bonding wires after the treatment; TEM shows that the thickness of the anti-sulfidation passive film is about 3 nm, which provides excellent anti-sulfidation performance. In addition, the lumen reaches 123.45lm, rising by 1.2% over untreated in LED device; lumen increases by 1.1% compared with unpassivated silver bonding wire after sulfidation test. Therefore, passivation process can solve the application of anti-sulfidation of silver alloy bonding wire. |
| Databáze: | OpenAIRE |
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