Thermal/mechanical analysis of novel Ceramic‐TSOP using nonlinear finite element method

Autor:	Ji‐Cheng Lin, Kuo-Ning Chiang
Rok vydání:	2001
Předmět:	Materials science business.industry Thermal resistance General Engineering Molding (process) Structural engineering Finite element method Thermal conductivity visual_art Heat generation Thermal visual_art.visual_art_medium Thermomechanical analysis Ceramic Composite material business
Zdroj:	Journal of the Chinese Institute of Engineers. 24:453-462
ISSN:	2158-7299 0253-3839
DOI:	10.1080/02533839.2001.9670642
Popis:	This research proposed a novel ceramic thin‐small‐outline package (Ceramic‐TSOP or C‐TSOP) to meet the high thermal performance and long‐term reliability considerations for today's low‐pin‐count, high‐performance electronic devices. To improve the molding compound and to simplify the fabrication process, molding compound is replaced by ceramic‐like stiffener which is adhered to the leadframe by a tape or adhesive as shown in Figs. 1(a) and 1(b). The ceramic‐like stiffener will overcome the low thermal conductivity problem of molding compound in a conventional LOC‐TSOP (Fig. 2) and increase the efficiency of thermal dissipation in the LOC‐TSOP. In this research, three‐dimensional (3D) nonlinear finite element models of both the conventional and novel LOC‐TSOP have been established. Various heat generation levels are applied to the 3D nonlinear models under natural convection conditions to evaluate heat dissipation capability and thermal resistance of the packages. The material properties and solde...
Databáze:	OpenAIRE
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