| Autor: |
Jing En Luan, Phone Maw Hla, Roseanne Duca, Kim-yong Goh |
| Rok vydání: |
2017 |
| Předmět: |
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| Zdroj: |
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC). |
| Popis: |
This paper provides a comprehensive study done experimentally and numerically to understand which are the key factors effecting block warpage and propose a practical modeling method for BOM selection based on the design for manufacturability approach. The study focuses on data collection and respective analysis, material characterization and FEM structural method. Development is also done at post-processing stage to account for tilts incurred and have modeling approach as close to reality as possible while taking calculated assumptions. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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