Extension of antenna rules for reducing P2ID in 0.13 Cu dual damascene technology

Autor:	Kay-Ming Lee, Qian-Wei Ding, M.C.C. Hsu, Chi-Liang Lin
Rok vydání:	2008
Předmět:	Materials science Plasma etching Electronic engineering Process (computing) Copper interconnect Plasma Macro Antenna (radio) Electrical conductor Dual (category theory)
Zdroj:	2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference.
ISSN:	1078-8743
DOI:	10.1109/asmc.2008.4529078
Popis:	This paper reports the new findings between plasma-charging damage and device surroundings. Antenna design rule has been widely used in semiconductor industry to decrease the plasma charging damage. It is found that even when circuit layout satisfies the antenna design rules, plasma-charging damage may still occur. Macro and micro pattern density are found to have an impact on plasma process induced damage (P2ID) on the device. Macro pattern density is related to the mask transmission ratio, while micro pattern density is related to the conductive structures surrounding the device.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e3dde205537de9e19fbbaa5d62d6214d https://doi.org/10.1109/asmc.2008.4529078 Zobrazit plný text záznamu