The Stress Analysis of Moisture-Thermal Coupling Based on an Advanced 3D Packaging

Autor:	Tingting Zhao, Haoran Wei, Haohui Ge
Rok vydání:	2022
Zdroj:	2022 7th International Conference on Integrated Circuits and Microsystems (ICICM).
DOI:	10.1109/icicm56102.2022.10011363
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e3c807ca3fc8ca209e94277a0aabe2e1 https://doi.org/10.1109/icicm56102.2022.10011363 Zobrazit plný text záznamu