Effects of surface finishes and loading speeds on shear strength of Sn–3.0Ag–0.5Cu solder joints
| Autor: | Myeong-Hyeok Jeong, Chang-Woo Lee, Jae-Myeong Kim, Sehoon Yoo, Young-Bae Park |
|---|---|
| Rok vydání: | 2012 |
| Předmět: |
Toughness
Materials science Metallurgy Shear force Electroless nickel immersion gold Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Brittleness Organic solderability preservative Soldering Shear strength Electrical and Electronic Engineering Composite material Ductility |
| Zdroj: | Microelectronic Engineering. 89:55-57 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2011.03.148 |
| Popis: | The effect of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the shear strength of Sn-3.0Ag-0.5Cu solder joints were investigated under the various loading speeds of 0.2-1000mm/s. Maximum shear force increased with increasing shear speed, while ductility and toughness decreased, while OSP finishes show lower shear strength rather than ENIG finishes. Overall, OSP finishes showed ductile to pad lift modes transition while ENIG finishes showed ductile to brittle modes transition with increasing shear speed. Therefore, strong interfacial adhesion of ENIG finishes rather than OSP finishes seems to be related to stronger bonding strength and also higher toughness of ENIG finishes. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full Text from ScienceDirect