A novel hermetic encapsulation approach for the protection of electronics in harsh environments

Autor:	Malte Spanier, Jakub Pawlikowski, Steffen Ziesche, Holger Kappert, Andreas Ostmann, Martin Jagle, Martin Schneider-Ramelow
Rok vydání:	2022
Zdroj:	2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e3acba0f167accefeeb04abaa4780be9 https://doi.org/10.1109/estc55720.2022.9939521 Zobrazit plný text záznamu