| Autor: |
R. B. Campbell, P. Rai-Choudhury, A. Rohatgi, R. E. Stapleton, E. J. Seman, J. R. Davis, J. W. Ostroski |
| Rok vydání: |
1979 |
| Předmět: |
|
| DOI: |
10.2172/5232756 |
| Popis: |
The process sequence for the fabrication of dendritic web silicon into solar panels has been modified to include aluminum back surface field formation. Sputtering is the preferred method for depositing the aluminum. Plasma etching has been shown to be a feasible technique for pre-diffusion cleaning of the web. This would replace wet chemical cleaning. Several contacting systems have been studied. The total plated Pd-Ni system (Motorola Process) is not compatible with our process sequence; however, the evaporated TiPd-electroplated Cu system has been shown stable under life testing. Ultrasonic bonding parameters have been determined for various interconnect and contact metals but the yield of the process is not sufficiently high to use for module fabrication at this time. Over 400 solar cells, about 11 cm/sup 2/ in area have been fabricated according to the modified sequence. No sub-process incompatibility was seen. These cells have been used to fabricate four demonstration modules. A cost analysis (SAMICS) of the modified process sequence resulted in a selling price of $0.75/peak watt (1980$ in 1986). |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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