Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders
| Autor: | Kaiyang Zeng, B.S.S. Chandra Rao, Vaidyanathan Kripesh, K. Mohan Kumar |
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| Rok vydání: | 2011 |
| Předmět: |
Materials science
Mechanical Engineering Zener–Hollomon parameter Metal matrix composite Composite number Metallurgy Strain rate Strain hardening exponent Condensed Matter Physics Mechanics of Materials Ultimate tensile strength General Materials Science Composite material Deformation (engineering) Tensile testing |
| Zdroj: | Materials Science and Engineering: A. 528:4166-4172 |
| ISSN: | 0921-5093 |
| Popis: | In this work, tensile deformation of Sn–3.8Ag–0.7Cu (SAC387) solder and composite of SAC387 reinforced with nano-sized Mo particles have been studied with strain rates from 10−5 to 10−1 s−1 and temperatures of 25, 75 and 125 °C. It is found that the yield strength (σY.S) and strain hardening exponent (n) are increased with the strain rate, but the n values decrease with increasing temperatures. The n values of the composite solder are also increased with the percentage of the Mo nano-particles (up to 1 wt.%) and thereafter decrease with further increasing of the Mo particle. The strain rate dependence of the Hollomon parameters is found to be stronger at higher temperatures for SAC387 solder, but it is weaker for the composite solders. Empirical equations for σY.S and Hollomon parameters with strain rate and temperatures have been found for both SAC387 and composite solders. Finally, the fracture surfaces of the solders are examined. |
| Databáze: | OpenAIRE |
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