Autor: |
Jonathan Casanova, Darryl Kostka, Mauro Lai, Madhumitha Seshadhri |
Rok vydání: |
2013 |
Předmět: |
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Zdroj: |
2013 IEEE International Symposium on Electromagnetic Compatibility. |
DOI: |
10.1109/isemc.2013.6670480 |
Popis: |
Passive channels pose significant challenges to the serial link transmission for single-ended buses running at very high speed. This paper will cover different aspects of the challenges in modeling chips, packages, PCB's, connectors and their interactions. The goal of the paper is to show full 3D link as well as hybrid 2D/3D link correlation for both passive (TDR/VNA) and active (system margins) measurements for a high speed memory bus. Full wave electromagnetic (EM) modeling is utilized to take into account important phenomena such as surface roughness and dispersive material behavior. The impact on system-level performance is analyzed by comparing results with and without crosstalk from adjacent lanes. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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