Ceramic substrate technology for wafer level packaging of MEMS
| Autor: | Martin Ihle, Steffen Ziesche, Felix Gabler, Frank Roscher |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Microelectromechanical systems
Materials science Packaging engineering business.industry ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION Engineering physics Embedded Wafer Level Ball Grid Array Substrate (building) Die preparation visual_art Electronic engineering visual_art.visual_art_medium Wafer Ceramic business Wafer-level packaging |
| Zdroj: | 2016 39th International Spring Seminar on Electronics Technology (ISSE). |
| Popis: | The contribution deals with a new wafer level based packaging technology for MEMS. Wafer level packages have advantages compared to standard packaging technologies (miniaturization, cost reduction due to work in multiple panels, optimization of functional parameters). Ceramic packaging technologies offer additional advantages compared to established glass based wafer level packaging. Some examples are a multilayer substrate buildup, a possible integration of passive components (R, L, C) resp. of cavities or channels into the ceramic and a cost efficient manufacturing. The contribution will broach the technologies of ceramic substrate preparation, of component joining and will comment on the advantages of a ceramic solution. |
| Databáze: | OpenAIRE |
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