| Autor: |
John Slabbekoorn, Yi Cao, Chunwei Chen, Robert Hsieh, Warren W. Flack, Andy Miller, Gareth Kenyon, Ping-Hung Lu, Eric Beyne, Manish Ranjan, Medhat A. Toukhy |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 IEEE 64th Electronic Components and Technology Conference (ECTC). |
| Popis: |
Large area silicon or glass interposers may exceed the maximum imaging field of step and repeat lithography tools. This paper discusses the lithographic process used to create a large area interposer on a stepper by the combination of multiple subfield exposures. Overlay metrology structures are used to confirm the relative placement of the subfields to construct the interposer. Routing lines from 1.5 to 4.0 μm in width are evaluated to measure critical dimension (CD) control where the lines cross the subfield boundaries. CD metrology at the bottom and top of the photoresist is performed using a top down CD-SEM. Finally large area test interposers are patterned using two subfields on a 1X stepper and processed through a Cu electroplating module for detailed characterization. The CD control of routing lines as they cross the subfield boundary can be optimized by using a shaped or tapered line end design. Lithography simulation using Prolith modeling software by KLA-Tencor is matched to experimental results and then used to evaluate performance of various line end designs. Larger latitude for overlap error was observed for the tapered line end compared to the standard square line end. The experimental and modeled results in this study show the capability of using stepper lithography to produce large area interposers with 1.5 μm I/O routing line dimensions. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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