| Popis: |
As the industry moves Beyond Moore, there has been much efforts for the next-generation of packaging, among which Fan-out wafer-level-package is getting significant attention with its high-degree heterogeneous integration capability, small form-factor. As fan-out package steps on mass production stage, Panel level package (PLP) is emerging as the most cost-effective solution featuring a large and efficient working area for a varied unit size and array, while commercialization of PLP needs to address some of significant technical challenges in particular by facing RDL formation with fine pitch pattern for specific applications. Here, we introduce various PLP solutions including discrete, PoP, module and 2.5D RDL-interposer. Finally, we explain the PLP development status and the next generation platforms in the future. |
