Properties of polyimide films doped with copper complexes

Autor:	S. A. Ezzell, Larry T. Taylor, T. A. Furtsch, E. Khor
Rok vydání:	1983
Předmět:	chemistry.chemical_classification Pyromellitic dianhydride Materials science Dopant Doping Inorganic chemistry chemistry.chemical_element Polymer Copper chemistry.chemical_compound chemistry Electrical resistivity and conductivity Etching Organic chemistry Polyimide
Zdroj:	Journal of Polymer Science: Polymer Chemistry Edition. 21:865-881
ISSN:	1542-9369 0360-6376
DOI:	10.1002/pol.1983.170210321
Popis:	Polyimide films based on either 3, 3′, 4, 4′-benzophenone tetracarboxylic acid dianhydride or pyromellitic dianhydride with 4,4′-oxydianiline have been doped with copper(I) and copper(II) complexes. High-quality, flexible, glass-cast films have been obtained which exhibit increased softening temperatures and lower polymer decomposition temperatures. The atmosphere and glass sides of the films are quite different. The copper(I) dopant is oxidized on the air side of the film, while the glass side contains predominantly copper (I). In the copper(II) case most of the copper appears on the air side as a silvery substance in the Cu(II) state. Chemical as well as ion etching can remove this material. Electrical resistivity of the copper(II)-doped films is decreased by three to five orders of magnitude relative to the polymer alone.
Databáze:	OpenAIRE
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