Growth, Thermal Stability and Cu Diffusivity of Reactively Sputtered NbN Thin Films as Diffusion Barriers between Cu and Si
| Autor: | Chih-Huang Lai, Chiapyng Lee, Po-Hao Tsai, Jing-Cheng Lin, Cheng-Lin Huang, Hsing-An Huang |
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| Rok vydání: | 2013 |
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| Zdroj: | ECS Journal of Solid State Science and Technology. 2:N152-N158 |
| ISSN: | 2162-8777 2162-8769 |
| DOI: | 10.1149/2.025307jss |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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