| Autor: |
V Magdum Pooja, S Patil Mahadev |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
2020 Second International Conference on Inventive Research in Computing Applications (ICIRCA). |
| DOI: |
10.1109/icirca48905.2020.9183171 |
| Popis: |
In power electronics, electro-migration is an important challenge and it is the main aspect to raise current concentration. On the other hand, in power electronics wrapping it is considered as advanced electrical current and voltages. That's why the result of electro-migration is a significant matter in claims which includes high current concentrations that were used in microelectronics and correlated constructions. EM failure caused owing to the dimension of integrated circuits (ICs) reduction and other practical significance. The effects of EM in power devices under high temperature is analysed in this research work. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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