Electron microscope observations of interdiffusion and ordering in copper-gold thin film diffusion couples
| Autor: | H. Bangert, P. Skalicky, A. Wagendristel, E. Semerad |
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| Rok vydání: | 1975 |
| Předmět: |
Materials science
Annealing (metallurgy) Alloy Metals and Alloys Analytical chemistry chemistry.chemical_element Surfaces and Interfaces engineering.material Atmospheric temperature range Copper Surfaces Coatings and Films Electronic Optical and Magnetic Materials law.invention chemistry Electron diffraction law Materials Chemistry engineering Crystallite Electron microscope Thin film |
| Zdroj: | Thin Solid Films. 28:337-344 |
| ISSN: | 0040-6090 |
| Popis: | Observation of interdiffusion and ordering in thin polycrystalline sandwich layers of copper and gold has been carried out by means of electron diffraction. Samples of total thickness 800 and 1000 A with thickness ratios corresponding to AuCu3, AuCu and Au3Cu respectively were vacuum deposited onto cleavage surfaces of NaCl. The diffusion experiments were performed in a temperature range around 200 °C. A preferred formation of the disordered AuCu3 alloy was found during diffusion, in agreement with previous X-ray investigations. The ordering was much slower than the interdiffusion process, resulting in the coexistence of ordered and disordered crystallites even after equalized concentration. More complete ordering was obtained only after extended annealing. The interdiffusion coefficient D was evaluated from the diffraction patterns using a new method and was found to be 3 × 10-4 exp (25 000/RT). |
| Databáze: | OpenAIRE |
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