Impact of Broken High Frequency Signal Return Path on Signal Integrity

Autor:	Thomas-Michael Winkel, Edoardo Genovese, Erich Klink, Roland Frech, Dierk Kaller
Rok vydání:	2006
Předmět:	Engineering business.industry Path (graph theory) Electronic engineering Measure (physics) Electronic packaging Signal integrity business Signal Area measurement Voltage
Zdroj:	2006 IEEE Workship on Signal Propagation on Interconnects.
DOI:	10.1109/spi.2006.289246
Popis:	Special test vehicles with and without broken high frequency signal return paths were built in order to measure their impact on signal integrity. Design guidelines for the transition between different packaging levels are derived and discussed.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::e1755c52b96a511f73fa466b6190b49d https://doi.org/10.1109/spi.2006.289246 Zobrazit plný text záznamu