The future of silicon-on-insulator (SOI) technology in microelectronic systems
| Autor: | J.C. Zolper, D.J. Radack, Z.J. Lemnios |
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| Rok vydání: | 2005 |
| Předmět: |
Engineering
Semiconductor technology business.industry Three-dimensional integrated circuit Silicon on insulator Hardware_PERFORMANCEANDRELIABILITY Integrated circuit Engineering physics law.invention law Hardware_INTEGRATEDCIRCUITS Technology integration Microelectronics business Hardware_LOGICDESIGN Electronic circuit |
| Zdroj: | 2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573). |
| DOI: | 10.1109/soi.2004.1391532 |
| Popis: | After many years of materials development and circuit research, silicon-on-insulator (SOI) technology clearly has become a viable approach for high performance microelectronics. As semiconductor technology continues to scale, the value of an SOI materials platform continues to expand. It has become a key technology to enable a new class of micro-scale functionality, through 3-D circuits and mixed technology integration. |
| Databáze: | OpenAIRE |
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