Autor: |
L. Keegan, Karthik Chandrasekharan, J. K. Wang, Balaji Narasimham, Gregory Djaja, S. Risch, J. Spillane |
Rok vydání: |
2013 |
Předmět: |
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Zdroj: |
2013 IEEE International Reliability Physics Symposium (IRPS). |
DOI: |
10.1109/irps.2013.6531990 |
Popis: |
Chip-level logic masking simulations were performed on a network processor with ~1.75M flip-flops to identify the masking factors and the functional blocks that contribute to most errors. Results indicate that most errors originate from a few functional blocks, and that targeted hardening of the flip-flops can significantly improve the overall system SER at very low area, speed, and power penalties. A novel hysteresis-based DFF hardening technique is presented with experimental results from a 28 nm test chip design. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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